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TSMC breaks ground on German fab
Taiwan Semiconductor Manufacturing Company (TSMC) has held a ground-breaking ceremony in the German city of Dresden for its first European fab.
The plant is a joint venture, with TSMC holding a 70%, and minority shares held by Robert Bosch, Infineon Technologies, and NXP Semiconductors. The planned fab has a total investment of €10 billion.
At the ground-breaking ceremony were TSMC chief executive officer CC Wei along with European Commission President Ursula von der Leyen and German Chancellor Olaf Scholz.
Construction is set to begin by the end of this year and TSMC has said that production is targeted to start by the end of 2027 when operational the fab is expected to have a monthly production capacity of 40,000 12-inch wafers using the 22 and 28-nanometre complementary metal-oxide-semiconductor technology as well as the 12 and 16-nanometre FinFET manufacturing processes.
TSMC has said the plant will focus on automotive chips and is expected to boost the semiconductor supply chain in Europe.
